Neuralinko
Neuralinko
Enterprise rack servers and custom computing nodes optimized for modern data center workloads, hyperscale cloud environments, and high-availability virtualization hosting.
Pioneering Enterprise AI Infrastructure and Custom Data Center Solutions.
Founded in 2018, Neuralinko Intelligent Technology Co., Ltd. stands as a premier server hardware ODM/OEM manufacturer. Operating from our advanced 386㎡ production, prototyping, and engineering facilities in Shenzhen, we specialize in configuring, manufacturing, and exporting enterprise rackmount servers, GPU computing clusters, and massive data storage architectures.
By bridging the gap between chipmaker innovations (including Intel Xeon, AMD EPYC, and leading GPU manufacturers) and global deployment requirements, Neuralinko helps clients scale bare metal clouds, high-performance computing (HPC) centers, and AI model training platforms. Through extensive supply chain vertical integration, we deliver systems engineered for thermal optimization, low-latency interconnectivity, and long-term hardware reliability.
Unlocking unparalleled hardware customizability, component velocity, and cost advantages through our Shenzhen logistics integration.
Positioned at the epicenter of global server component fabrication, we maintain direct relationships with mainboard manufacturers, copper heat sink extruders, backplane designers, and high-frequency connector producers. This bypasses intermediary trading margins, passing savings onto the client.
With 118 R&D engineers, we take custom chassis requirements, specialized drive backplanes, and cooling array modifications from layout to prototype testing in days. Our physical proximity to manufacturing plants permits real-time mechanical adjustments.
From low-volume enterprise pilot designs to multi-rack hyperscale clusters, our assembly lines adapt dynamically. By cultivating a network of over 1,200 verified sub-suppliers, we mitigate component shortages and stabilize volume throughput.
A granular exploration of custom board layout design, firmware tuning, cooling adjustments, and hardware integration.
Hosting providers demand compute efficiency that off-the-shelf options cannot provide. We craft chassis optimization configurations that fit more nodes per U, reducing overall rack costs:
With workloads shifting to large language models (LLMs) and computer vision, Neuralinko enables hosting providers to offer specialized AI cloud compute capabilities:
Ensuring hardware deployments satisfy stringent multi-regional certifications, electrical standards, and logistical requirements.
All hardware components undergo validation to meet European Union CE, North American FCC Part 15 Class A, and RoHS standards. We generate compliant documentation, safety labels, and emissions profiles, minimizing border clearance holding times.
We customize system configuration screens, telemetry options, and out-of-band management firmware in multiple languages (English, German, French, Japanese, Spanish) to match the operational expectations of localized data center support teams.
To prevent transit damage of high-value server assemblies, we utilize custom-molded, high-density polyethylene (EPE) foam dampeners and heavy-duty, double-walled corrugated shipping cartons. For complete rack deployments, we configure shock-isolated, ocean-worthy wooden crate packaging.
How our 42-inspector quality assurance team guarantees enterprise reliability.
No node is packed without passing our multi-tiered validation workflow, ensuring zero dead-on-arrival (DOA) incidents at your datacenters:
We implement testing procedures that isolate structural, firmware, and logical issues:
Aligning server acquisitions with modern environmental and computing requirements.
Modern hosters require platforms that deliver higher compute densities per cabinet. Transitioning to high-core-count processors (such as Intel Scalable and AMD EPYC architectures) combined with compact chassis designs reduces footprint demands.
Reducing Power Usage Effectiveness (PUE) is critical for modern green data centers. Dynamic fan control configurations, liquid-to-air cooling options, and titanium power supplies reduce cooling overhead and operating expenses.
Securing user environments starts with the server hardware. Modern configurations include integrated TPM 2.0 chips, secure boot capabilities, and customized BMC firmware encryption to prevent low-level exploits.
Answers to common logistical, engineering, and manufacturing questions for enterprise buyers.
For basic system configuration adjustments (CPU, Memory, storage expansion), our MOQ is 1 unit. For deep ODM customizations, including custom screen-printed sheet metal chassis, proprietary PCB backplanes, and branded BIOS/BMC configurations, our typical MOQ starts at 20 units per batch.
We offer a standard 3-year warranty on core server assemblies. In the event of a component issue, we expedite replacement parts (motherboards, power supplies, drive backplanes) via international express (DHL/FedEx). For enterprise hosting partners, we can supply an on-site spares kit containing critical components to keep downtime to a minimum.
Yes. We can install and pre-configure OS images (e.g., Rocky Linux, Ubuntu Server, Proxmox VE, VMware ESXi, TrueNAS) onto your ordered servers prior to packaging. This includes setting custom network parameters, root credentials, and default partition structures, enabling plug-and-play installation.
All our servers use high-efficiency hot-swappable CRPS power supplies configured with auto-ranging inputs (100V-240V AC, or optional -48V DC for telecommunication setups), ensuring stable operations in European, North American, Asian, and Australian data center environments.
Our engineering team designs backplanes utilizing high-speed PCB raw materials (such as Megtron 6/7) and runs simulated trace-length impedance calculations. Physical models undergo high-frequency oscilloscope testing to ensure transmission reliability across PCIe lanes.
Standard configurations can ship within 7 to 15 business days. Deep custom configurations requiring custom chassis fabrication, paint finishes, and custom electronics assembly typically require 30 to 45 days for final production and quality clearance.
Scale compute power, enhance local storage, and optimize processing speed with components designed for critical infrastructure.
